Study PCB component detachment failures during SMT reflow soldering. Analyze root causes including insufficient glass fiber-resin wetting and thermal stress, and introduce metallographic, SEM, TMA, DSC test methods and effective improvement measures for PCB substrate quality.
Comprehensive PCB failure analysis covering four major failure modes: conductivity failure, poor solderability, delamination, and insulation failure. Learn quality assurance strategies to reduce PCB failure rates and improve electronic product reliability.
Failure analysis is a crucial component of product reliability engineering. It is widely applied to determine the causes of production issues during development and manufacturing, identify reliability-related failures during testing。
