This article analyzes common pitfalls of PCB layout details including routing corners, trace width and trace spacing. It explains hidden issues undetectable by conventional DRC, together with real mass-production cases and standardized design workflows for hardware and layout engineers.
This article introduces PCB trace width definition, calculation formulas and IPC standards. It explains the correlation between PCB trace width and current carrying capacity, impedance and signal reflection, together with practical layout cases for high-speed and power circuits.
This article clarifies the distinctions between PCB and ABF substrate. Compare their scale, fabrication processes, materials, industrial positioning and common misconceptions, covering AI chip packaging and domestic substitution trends.
This paper investigates lamination defects including board warpage and copper surface indentations on millimeter-wave radar circuit boards with asymmetric PTFE/High-Tg hybrid stack-up. Root causes are analyzed, stack-up redesign and two-stage lamination are proposed, and full-process cleaning controls are verified to reduce defect rate for automotive radar PCBs.
This paper introduces post-Moore’s-Law semiconductor advanced packaging including 2.5D/3.0D packaging, heterogeneous integration, CoWoS, EMIB, fan-out, CPO and panel-level packaging. It analyzes how advanced packaging blurs boundaries among chips, packages and PCBs and drives upgrades in IC substrate, materials and manufacturing equipment.
This paper classifies embedded copper block PCBs into copper-insert type and buried copper block type. It systematically introduces process flow, machining parameters, process capability and comparison of two structures, providing quantifiable manufacturing control rules for high-power, high-reliability PCBs used in automotive electronics, industrial control and communication power amplifiers.
This paper studies AOI false positive NG detection in integrated circuit manufacturing. It analyzes false alarms from mark recognition, panel inspection …
This paper studies PCB micro-drilling copper foil chip formation for multilayer heterogeneous PCB. It explores how spindle speed, feed rate, drilling quantity, helix angle and point angle affect …
This article conducts PCB via hole electroplating failure analysis and process optimization research on automotive PCBA open-circuit samples. Metallographic section, SEM, thermal shock and TMA thermal performance tests are adopted to study the mechanism of via copper fracture and put forward electroplating and drilling process improvement suggestions.
This paper introduces PCB thermal design and heat dissipation technology, covering substrate material selection, component layout optimization, trace & thermal via design, component packaging selection and thermal path optimization for circuit boards.
