With the continuous improvement of precision for electronic products, shrinking component sizes, and diversified types of PCB substrates and finished products, various electronic auxiliary materials have been widely adopted.
As a new type of stencil-free solder paste application technology, solder paste spray printing has demonstrated significant practical value in the production of military electronic products due to its convenience and flexibility.
Before a new PCB assembly model enters mass production, it typically requires validation through multiple prototype versions.
With the trend toward smarter and more integrated electronic products, a wide range of BGAs, fine-pitch components, and ultra-small devices are now in widespread use, making SMT technology the mainstream process for electronic assembly.
When designing printed circuit boards, PCBA designers often include process margins. Do you know why they do this? What are the benefits of including process margins?
