This paper investigates lamination defects including board warpage and copper surface indentations on millimeter-wave radar circuit boards with asymmetric PTFE/High-Tg hybrid stack-up. Root causes are analyzed, stack-up redesign and two-stage lamination are proposed, and full-process cleaning controls are verified to reduce defect rate for automotive radar PCBs.
This paper introduces post-Moore’s-Law semiconductor advanced packaging including 2.5D/3.0D packaging, heterogeneous integration, CoWoS, EMIB, fan-out, CPO and panel-level packaging. It analyzes how advanced packaging blurs boundaries among chips, packages and PCBs and drives upgrades in IC substrate, materials and manufacturing equipment.
This paper studies AOI false positive NG detection in integrated circuit manufacturing. It analyzes false alarms from mark recognition, panel inspection …
This article conducts PCB via hole electroplating failure analysis and process optimization research on automotive PCBA open-circuit samples. Metallographic section, SEM, thermal shock and TMA thermal performance tests are adopted to study the mechanism of via copper fracture and put forward electroplating and drilling process improvement suggestions.
Compare immersion gold (chemical nickel-gold) and electroplated gold (electrolytic nickel-gold) for PCBs, including gold thickness, crystal structure, solderability, flatness, short-circuit risk and applicable scenarios.
Learn FPC bend life testing for flexible printed circuits, including IPC & GB standards, bend radius, bending frequency, failure criteria, test equipment selection and practical testing precautions.
Analyze root causes of PCB warpage after SMT through comparative experiments covering baking process, PCS connection design and substrate material, provide practical engineering optimization suggestions for PCB manufacturers and assembly plants.
Learn PCB classification by layers, substrate and special-process types. Explore the full 13-step multilayer PCB manufacturing workflow, HDI vs standard multilayer boards and key ordering parameters for electronics engineers and procurement.
Understand mSAP PCB modified semi-additive process. Explore market growth driven by 1.6T/3.2T AI optical modules, supply bottlenecks, industry-chain beneficiaries and technical development outlook.
Learn about the PCB OSP surface treatment process, including full workflow, key process requirements, core advantages and typical applications in automotive, consumer electronics and IoT PCB manufacturing.
